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R U Going to Attend the Second Annual Chiplet Summit?

As I pen these words, only a few days remain until the start of the biggest, bestest, and most bodacious second annual Chiplet Summit, which is to be held 6-8 February 2024 at the Santa Clara Convention Center in Santa Clara, California. As an aside (yes, I know we just started and it’s a little…

Santa clara convention centerUnited statesTony chan carusoneAllyson kleinBapi vinnakotaAgilex fpgasSam salamaAbhijeet chakrabortyMick posnerLady adaSanta claraEditor of designing electronics north americaData center marketingPackaging technology accelerates major compute tasksChiplet summitDesigning electronics north america

Ventana Launches Veyron V2 RISC-V Into The Datacenter

It took the X86 architecture fifteen years get an appreciable share of datacenter compute, and it took the Arm architecture about ten years to get a

Lei shanBergamo epycBalaji bakthaKnights xeon phiSemiconductor manufacturingAmazon web servicesArm ltdCisco systemsSeagate technologyGoldman sachsFidelity investmentsTaiwan semiconductor manufacturing coIbm tj watson research centerArm holdingsEsperanto technologiesVentana micro systems

JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation

ARLINGTON, Va. (BUSINESS WIRE) Oct 10, 2023

United statesCliff grossnerMichael durkanEmily desjardinsDirk van slykeChiplet design exchangeTask groupSan jose convention centerOpen compute project foundationData extensible markup languageModel guidelinesGroup chairOpen domain specific architectureOpen compute projectChiplet design kitChief innovation officer

JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation

JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation
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Emily desjardinsCliff grossnerDirk van slykeMichael durkanChiplet design exchangeTask groupSan jose convention centerOpen compute project foundationData extensible markup languageModel guidelinesGroup chairOpen domain specific architectureOpen compute projectChiplet design kitChief innovation officerSan jose convention center october

Eliyan Applauds Release of OCP s Latest Multi-die Open Interconnect Standard, BoW 2 0; Demonstrates Industry s First Working Silicon Compliant with the Spec

/PRNewswire/ Eliyan Corporation, credited for the invention of the semiconductor industry s highest-performance and most efficient chiplet interconnect,.

Bapi vinnakotaRamin fajadradPrnewswire eliyan corporationOpen compute projectOpen domain specific architectureMulti gbps enterprise ethernetOpen chiplet economyOpen compute project foundation