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Kuprion Introduces ActiveCopper Filled Thermal Vias
Kuprion, Inc., a spinout of Lockheed Martin, has introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems. 
Lead-free and RoHs-compliant, ActiveCopper is a flowable, engineered copper paste a dense and sticky form of copper, which is safe to handle in air. To enhance heat and power dissipation, ActiveCopper Filled Thermal Vias provide a more efficient heat dissipation path directly incorporated into PCBs with placement directly under a surface-mounted IC ‘heat source’ that allows direct surface mount bonding for maximum heat transfer using Kuprion’s surface mount copper material. Placing the large 3-5mm diameter thermal vias directly underneath an IC allows direct bonding to such a via, a ....

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