Kuprion Introduces ActiveCopper Filled Thermal Vias Kuprion, Inc., a spinout of Lockheed Martin, has introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems. Lead-free and RoHs-compliant, ActiveCopper is a flowable, engineered copper paste—a dense and sticky form of copper, which is safe to handle in air. To enhance heat and power dissipation, ActiveCopper Filled Thermal Vias provide a more efficient heat dissipation path directly incorporated into PCBs with placement directly under a surface-mounted IC ‘heat source’ that allows direct surface mount bonding for maximum heat transfer using Kuprion’s surface mount copper material. Placing the large 3-5mm diameter thermal vias directly underneath an IC allows direct bonding to such a via, and enables significant reduction in thermal resistance. This facilitates efficient heat dissipation not only on the top surface, but through the PCB to the back side.