Ossia Inc., a wireless device manufacturer, and Marubun Corporation, which provides solutions in the semiconductor and electronics business, will leverage Ossia s technology to create IoT sensor. | December 8, 2021
Ossia Inc., a wireless device manufacturer, and Marubun Corporation, which provides solutions in the semiconductor and electronics business, will leverage Ossia s technology to create IoT sensor receivers that can be used to power devices such as inventory trackers and headsets…
/PRNewswire/ Ossia Inc., the company that created Cota® Real Wireless Power™, and Marubun Corporation, which provides total solutions in the semiconductor.
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eYs3D Microelectronics raises $7m in Series A funding eYs3D Microelectronics, a fabless design house targeting computer vision for edge AI, has raised $7 million in Series A funding from strategic partners including: ARM IoT Capital, WI Harper Group and Marubun Corporation.
The funding will allow eYs3D to grow its new product development for AI-based autonomous operation, including robotics, security, touchless control, autonomous vehicles and smart retail.
eYs3D was spun off from Etron Technology in 2016 and this new investment will allow it to build out its embedded chip business in additional markets and bring the startup to the next level. Among the investors ARM will work with eYs3D to focus on the integration of its chips with ARM s CPU/NPU processors; while WI Harper Group will provide access to its large industrial partners base and ecosystem; and Marubun, a global distributor, joined the funding round to open up new distribution channels for the c