Intel's 288-Core Clearwater Forest Xeon CPU to Utilize Foveros 3D Stacking: Report extremetech.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from extremetech.com Daily Mail and Mail on Sunday newspapers.
TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.
Intel's 13th-gen Core processors are on the horizon, but they shouldn't stray too far from their predecessors regarding microarchitecture. After all, Intel uses the same Intel 7.