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Intel's 288-Core Clearwater Forest Xeon CPU to Utilize Foveros 3D Stacking: Report

3D chip stacking tech competition intensifying

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.

Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs

Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.

Intel wants to achieve 1 trillion transistors on a package by 2030 using chiplets

Intel's 13th-gen Core processors are on the horizon, but they shouldn't stray too far from their predecessors regarding microarchitecture. After all, Intel uses the same Intel 7.

Intel's CPU roadmap: Aggressive tech advances spur power efficiency

Intel is trying to convince investors that Moore's Law is alive and well.