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NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries

NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
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Bonding Capillaries Market is projected to grow at a CAGR of 6 70 % by 2030

The global bonding capillaries market is anticipated to grow from USD 1.60 Billion in 2023 to USD 2.52 Billion by 2030, at a CAGR of 6.70 % during the forecast period.

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Chipmaking parts supplier Besi misses order estimates, shares drop, ET Telecom

Besi: French-Italian STMicroelectronics on Thursday became the latest chipmaker to lower its full-year guidance due to declining orders.

Nathan vifflinBe semiconductor industries besiSamsung electronicsVisible alphaBe semiconductor industriesSemiconductor marketSmartphone demandAutomotive applicationsYbrid bonding orders

Diversification giving boost to chip targets

Diversification giving boost to chip targets
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Besi exceeds quarterly targets on AI-related chip parts orders, ET Telecom

Besi: Orders for the fourth quarter totalled 166 million euros ($180 million), part of which are expected to be shipped over the second and third quarters of 2024, the company said.

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