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Japanese precision component manufacturer Orbray announced that it has signed a contract with automotive semiconductor R&D corporation Mirise Technologies to conduct R&D on diamond power semiconductors. In addition, Orbay also stated that it is investing JPY10 billion (US$72 million) to build a diamond substrate factory for automotive semiconductors. ....
Kariya, Kuwana, Japan/Hsinchu, Taiwan, May 10, 2023 - (JCN Newswire) - DENSO CORPORATION (DENSO), a leading mobility supplier, and United Semiconductor Japan Co., Ltd. ("USJC"), a subsidiary of global ....
DENSO CORPORATION , a leading mobility supplier, and United Semiconductor Japan Co., Ltd. , a subsidiary of global semiconductor foundry United Microelectronics Corporation , today announced a joint. | May 10, 2023 ....