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GRENOBLE, France – April 13, 2023 – CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May 30-June 2, in Orlando, Fla. The institute is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch)… ....
A technologically advanced urban setting known as a "smart city" employs the ubiquitous connection among numerous digital devices and sensors to enhance urban development projects and collect data. In turn, the data and information improve operations throughout the city. ....
Related Paper Covers Efficient Characterization Flow of Industrial Grade Si-Based Qubits Invited Paper Reports Breakthrough on Path Toward Cryogenic Compact Model SAN FRANCISCO – Dec. 8, 2022 – CEA-Leti presented three papers at IEDM 2022 detailing its recent advances and future challenges in quantum computing using Si-based qubit devices with FDSOI technologies. A plenary talk… ....
Nanotechnology Now - Press Release: CEA-Leti Barn-Owl Inspired, Object-Localization System Uses Up to '5 Orders of Magnitude' Less Energy than Existing Technology: Paper in Nature Communications Describes Neuromorphic Computing Device With 'Virtually No Power Consumption' When Idle, Thanks to On-Chip Non-Volatile M nanotech-now.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from nanotech-now.com Daily Mail and Mail on Sunday newspapers.
GRENOBLE, France – July 7, 2022 – Inspired by the barn owl’s neuroanatomy, CEA-Leti has developed an event-driven, object-localization system that couples state-of-the-art piezoelectric, ultrasound transducer sensors to a neuromorphic, resistive memories-based computational map. Presented in a paper published recently in Nature Communications, the research team describes development of an auditory-processing system that increases energy efficiency… ....