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CEA-Leti Showcases Advanced Integration and Packaging Strategies for HPC and Edge-AI Chiplets at ECTC

CEA-Leti Showcases Advanced Integration and Packaging Strategies for HPC and Edge-AI Chiplets at ECTC
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CEA-Leti to Report Progress on 3D Interconnects for Wafer-Level Platforms At Electronic Components and Technology Conference, May 30-June 2

GRENOBLE, France – April 13, 2023 – CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May 30-June 2, in Orlando, Fla. The institute is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch)… ....

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