Transphorms SuperGaN at PCIM 2024 Surpassing SiC and emode GaN Capabilities in High Power Systems

Transphorm Inc. Nasdaq TGAN the global leader in robust GaN power semiconductors announced today that its PCIM 2024 showcase will underscore its ability to outperform competitive wide bandgap technologies in higher power systems.

Related Keywords

United States , Japan , Aizu , Fukushima , Goleta , California , Heather Ailara , Philip Zuk , Transphorm Inc , Nasdaq , Business Development , Twitter , Silicon Carbide , Power Systems , Gan Wide Bandgap Design , Senior Vice President , Core Platform , Industry Standard , Meet With , Power Gan , Media Contact ,