Latest Breaking News On - ப்யாகேஜிஂக் ஆய்வகம் - Page 2 : comparemela.com

Login or register now to gain instant access to the rest of this premium content! Pictured is Indiana State University senior packaging engineering technology major Cole Weathers. Weathers credits his hands-on learning experiences with Esko software in the classroom and in ISU’s Packaging Lab for helping him secure a position with Welch Packaging, based in Elkhart, Ind., upon graduation in May. Indiana State University received a multi-million-dollar in-kind gift of package engineering technology software from Esko, a global developer of integrated software and hardware solutions for the packaging industry. This partnership continues the company’s two decades of support for the program.

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