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Pictured is Indiana State University senior packaging engineering technology major Cole Weathers. Weathers credits his hands-on learning experiences with Esko software in the classroom and in ISU’s Packaging Lab for helping him secure a position with Welch Packaging, based in Elkhart, Ind., upon graduation in May.
Indiana State University received a multi-million-dollar in-kind gift of package engineering technology software from Esko, a global developer of integrated software and hardware solutions for the packaging industry. This partnership continues the company’s two decades of support for the program.
Esko donates to Indiana State University labelsandlabeling.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from labelsandlabeling.com Daily Mail and Mail on Sunday newspapers.