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Samsung develops new technology to make faster and more efficient chips Samsung, the world leader in semiconductor space, has announced that it has developed a new chip packing technology that could make chips faster and more power-efficient. The I-Cube4 technology is an improvement over the company’s I-Cube 2 technology from 2018 and X-Cube technology from 2020. The company’s I-Cube4 (Interposer-Cube4) is a 2.5D heterogeneous chip packaging technology. It can be used to horizontally place multiple logic dies (CPU, GPU, and NPU) and several HBM (High Bandwidth Memory) dies on top of a silicon interposer, making several dies act as a single chip. This technology was developed in March 2021, and it has already been used to put one logic die, and four HBM dies on a single chip.

United statesMoonsoo kangFoundry market strategy at samsung electronicsChip packaging technologyHigh bandwidth memorySamsung foundrySenior vice presidentFoundry market strategySamsung electronicsஒன்றுபட்டது மாநிலங்களில்ஃபவுண்டரி சந்தை மூலோபாயம் இல் சாம்சங் மின்னணுவியல்சிப் ப்யாகேஜிஂக் தொழில்நுட்பம்உயர் அலைவரிசை நினைவுசாம்சங் ஃபவுண்டரிமூத்தவர் துணை ப்ரெஸிடெஂட்ஃபவுண்டரி சந்தை மூலோபாயம்