(0) I-Cube4 incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management as well as stable power supply
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again.
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Samsung s I-Cube4 for high-performance applications (Photo: Business Wire)
Samsung s I-Cube
TM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.
Samsung Electronics: Next Generation 2.5D Integration Solution ‘I-Cube4’ Available
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again.
Samsung’s I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.
Samsung’s new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between lo
Samsung develops new technology to make faster and more efficient chips
Samsung, the world leader in semiconductor space, has announced that it has developed a new chip packing technology that could make chips faster and more power-efficient. The I-Cube4 technology is an improvement over the company’s I-Cube 2 technology from 2018 and X-Cube technology from 2020.
The company’s I-Cube4 (Interposer-Cube4) is a 2.5D heterogeneous chip packaging technology. It can be used to horizontally place multiple logic dies (CPU, GPU, and NPU) and several HBM (High Bandwidth Memory) dies on top of a silicon interposer, making several dies act as a single chip. This technology was developed in March 2021, and it has already been used to put one logic die, and four HBM dies on a single chip.