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OpenFive Launches Die-to-Die Interface Solution for Chiplet Ecosystem

Features IOs running at up to 16Gbps (effective throughput of ~1.75Tbps/mm) Features extremely low latency and 0.5pJ/bit offering best power performance benchmarks SAN MATEO, Calif.–(BUSINESS WIRE)–OpenFive, the leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the launch of a Die-to-Die (D2D) PHY that complements the company’s existing D2D Controller to offer complete D2D interface solutions for various packages including substrates and interposers. The new D2D PHY helps disaggregate large SoC die into smaller die, resulting in better yield, cost and power savings. It features up to 16Gbps NRZ signals with clock forwarding architecture. Each channel, comprising of 40 IOs, can provide effective throughput of up to ~1.75Tbps/mm. Users can stack up multiple channels to further increase overall throughput. The PHY also features built-in PLL, programmable output drivers, and link training state machines.

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SiPearl and Open-Silicon Research collaborate to accelerate custom silicon for HPC applications – CIE

4 weeks ago 168 Views SiPearl, the company designing the high-performance, energy-efficient microprocessor for the European exascale supercomputer and Open-Silicon Research, the India based entity of OpenFive, a provider of custom silicon solutions with differentiated IP, announced a multi-year joint collaboration to enable expansive development of innovative High Performance Computing (HPC) applications. Specifically, SiPearl is relying on Open-Silicon Research’s expertise in deep-submicron physical design implementation, advanced 2.5D packaging and global supply chain management to develop the highly integrated, high-performance 6nm system-on-a-chip (SoC) named RHEA. SiPearl’s Rhea SoC is designed in a leading-edge 6nm process node and will be implemented by Open-Silicon Research and manufactured at Taiwan Semiconductor Manufacturing Company (TSMC). OpenFive is a long-standing partner of TSMC through its Value Chain Aggregator (VCA) program. Applications using artificial

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SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications

SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
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History of the Modern Graphics Processor, Part 5

History of the Modern Graphics Processor, Part 5
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Lucintel: Opportunities for The Global Artificial Intelligence Market to Reach $70 Billion By 2025

Lucintel: Opportunities for The Global Artificial Intelligence Market to Reach $70 Billion By 2025
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