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Jun 10, 2021 01:24 EDT with 3 comments
Memory chipmaker SK hynix recently updated one of its specs pages for HBM2E and has perhaps inadvertently given away the initial specifications of the next-gen HBM3 standard. Despite its name, HBM3 is actually the fourth generation of the High Bandwidth Memory (HBM) design and according to SK hynix, the new standard will offer 665GB/s or more in terms of bandwidth with an I/O speed of 5.2Gbps.
This means that there is an uplift of close to 50% in the bandwidth as well in I/O speed. However, we still don t know some of the other key specs of HBM3 s arrangement. For example, details on the 3D stack height and die density of the next-gen design are unavailable at this moment which means we can t determine the maximum capacity of memory each stack of HBM3 will be able to accommodate.