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YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer Share Article Yield Engineering Systems, Inc. announces that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding, utilized in bringing next-generation HBM (high bandwidth memory) to market. This new VertaBond system will enable our valued customer’s most advanced HBM development and pilot production,” said Alex Chow, Asia Sales President & General Manager at YES. FREMONT, Calif. (PRWEB) March 15, 2021 YES (Yield Engineering Systems, Inc.), a preferred provider of material modification and surface enhancement solutions for the semiconductor, life science and display markets, today announced that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding. The new system will be utilized in bringing next-generation HBM (h

United statesAlex chowEngineering systems incLife sciencesEngineering systemsAsia sales presidentGeneral managerYield engineering systemsZia karimAdvanced packagingVirtual realityPress releaseஒன்றுபட்டது மாநிலங்களில்அலெக்ஸ் சோவ்பொறியியல் அமைப்புகள் இன்க்வாழ்க்கை அறிவியல்