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Samsung boosts workforce at Japan R&D lab to drive chips packaging innovations

Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation semiconductor packaging technologies.

South-korea
Japan
Yokohama
Kanagawa
South-korean
Japanese
Minato-mirai
Samsung
Bg-fund
Packaging-laboratory
Samsung-electronics
Advanced-packaging-laboratory

ERS electronic releases fully automatic Luminex machines with PhotoThermal debonding and wafer cleaning capability

/PRNewswire/ ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic.

Munich
Bayern
Germany
China
Debbie-claire-sanchez
Taguhi-yeghoyan
Senior-technology-market-analyst
Semiconductor-equipment-at-yole-group
Senior-technology
Market-analyst
Semiconductor-equipment
Advanced-packaging-equipment

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