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Samsung boosts workforce at Japan R&D lab to drive chips packaging innovations

Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation semiconductor packaging technologies.

ERS electronic releases fully automatic Luminex machines with PhotoThermal debonding and wafer cleaning capability

ERS electronic GmbH: ERS electronic releases fully automatic Luminex machines with PhotoThermal debonding and wafer cleaning capability

MUNICH, May 29, 2024 /PRNewswire/ ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from

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