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Advanced packaging market on 11% CAGR 2022-28
The advanced IC substrate market is expected to grow at an 11% CAGR from $15 billion in 2022 to nearly $34 billion in 2028, says Yole Developpement. Asian
South korea
United states
Yole vishal saroha
Yole bilal hachemi
Embedded die
Glass core
Bilal hachemi
East asia
Vishal saroha
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