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Advanced packaging market on 11% CAGR 2022-28

The advanced IC substrate market is expected to grow at an 11% CAGR from $15 billion in 2022 to nearly $34 billion in 2028, says Yole Developpement. Asian

South koreaUnited statesYole vishal sarohaYole bilal hachemiEmbedded dieGlass coreBilal hachemiEast asiaVishal saroha

Green Lambda Corporation Acquires Fiber Mountain, Inc

Advanced Solutions to Track, Monitor, and Automate Network Infrastructure.

Asang coocGreen lambda corporationGreen lambda corporation contactFiber mountain incLambda corporationFiber mountainGreen lambdaGlass coreFiber mountainGreen lambdaNetwork automationNetwork infrastructure

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