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Synopsys Accelerates Multi-Die System Designs With Successful UCIe PHY IP Tape-Out on TSMC N3E Process

New Electronics - Winbond joins UCIe Consortium to support chiplet interface standardisation

Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry body that's dedicated to advancing UCIe technology.

Debendra-das-sharma
Ucie-consortium
Artificial-intelligence
Hsiang-yun-fan

Winbond joins UCIe Consortium to support high-performance chiplet interface standardisation

/PRNewswire/ Winbond has joined the UCIe™ (Universal Chiplet Interconnect Express™) Consortium, the industry Consortium dedicated to advancing UCIe.

Taiwan
China
Germany
Japan
United-states
Hong-kong
Israel
Debendra-das-sharma
Chih-chung-chou
Ucie-consortium
Winbond-electronics-corporation
Universal-chiplet-interconnect-express

Eliyan raises $40m

New Electronics - Eliyan closes $40m Series A funding round

Eliyan, credited with developing the most efficient chiplet interconnect currently available, has announced that it has closed its Series A $40m funding round, and has successfully concluded the tapeout of its technology on an industry standard 5-nanometer (nm) process.

Ramin-farjadrad
Ucie-consortium
Intel
Open-compute-project
Universal-chiplet-interconnect-express
Tracker-capital-management
High-bandwidth-memory

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