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UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI

Winbond, Faraday, ASE, and Cadence comprise project members to provide a one-stop platform for customers’ stacked silicon needs .

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Winbond and Mobiveil collaborate on ultra-low power applications – CIE

Winbond and Mobiveil collaborate on ultra-low power applications – CIE
cieonline.co.uk - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from cieonline.co.uk Daily Mail and Mail on Sunday newspapers.

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New Electronics - Winbond and Mobiveil collaborate on ultra-low power applications

Winbond Electronics, a supplier of semiconductor memory solutions, and Mobiveil, a fast-growing supplier of Silicon Intellectual Property (SIP), platforms and IP-enabled design services, have announced a new collaboration.

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Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers

Mobiveil HYPERRAM Controller Leverages Winbond’s HYPERBUS-based HYPERRAM x8/x16 with 250 MHz Memory Device Targets Automotive, Smart IoT, Industrial, Wearables, TWS, Wireless headsets, Smart Speakers, Connectivity Applications MILIPITAS, CALIF. –– August 2, 2023 –– Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced a partnership with Winbond to…

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New Electronics - Winbond joins UCIe Consortium to support chiplet interface standardisation

Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry body that's dedicated to advancing UCIe technology.

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