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Cadence Cerebrus Delivers Transformative Results on Next-Gen Designs

Cadence Cerebrus Delivers Transformative Results on Next-Gen Designs
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Chin chi tengHarrison hsiehDigital signoff group at cadenceSilicon product development at mediatekCadence design systemsDesign systemsCadence cerebrus intelligent chip explorerCadence cerebrusSignoff groupSilicon product development

Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs

Highlights: • MediaTek shrinks die area by 5% and reduces power by more than 6% with the Cadence Cerebrus floorplan optimization feature • Cadence collaborates with Renesas to deploy Cadence Cerebrus on two designs; achieves better performance on an advanced-node CPU design and a leakage power reduction on an MCU design SAN JOSE, Calif., June…

Chin chi tengHarrison hsiehToshonori inoshitaDigital signoff group at cadenceRenesas electronics corporationSilicon product development at mediatekCadence design systems incCadence cerebrusCadence design systemsIntelligent chip explorerSignoff groupSilicon product developmentRenesas electronicsImplementation systemSynthesis solutionTiming signoff solution

Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs – Consumer Electronics Net

Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs – Consumer Electronics Net
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Chin chi tengHarrison hsiehToshonori inoshitaDigital signoff group at cadenceRenesas electronics corporationSilicon product development at mediatekCadence design systems incCompanies to workCadence cerebrusCadence design systemsIntelligent chip explorerSignoff groupSilicon product developmentRenesas electronicsImplementation systemSynthesis solution

Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs - Press Release

Highlights: MediaTek shrinks die area by 5% and reduces power by more than 6% with the Cadence Cerebrus floorplan optimization feature Cadence collabo

Chin chi tengHarrison hsiehToshonori inoshitaDigital signoff group at cadenceRenesas electronics corporationSilicon product development at mediatekCadence design systems incCompanies to workCadence cerebrusDesign systemsIntelligent chip explorerSignoff groupSilicon product developmentRenesas electronicsImplementation systemSynthesis solution

JEDEC publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications – Consumer Electronics Net

JEDEC publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications – Consumer Electronics Net
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Mian quddusKatsushi inoueHarrison hsiehMemory divisionSilicon product development at mediatekSolid state technology associationState technology associationRemovable memory deviceCrossover flash memoryElectrical specificationsCommand protocolsExtended realitySenior directorSenior general managerSilicon product development