Siemens automates 2 5D and 3D IC design-for-test with new Tessent multi-die solution globalspec.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from globalspec.com Daily Mail and Mail on Sunday newspapers.
Siemens Digital Industries Software has introduced the Tessent Multi-die software solution, which it says will help customers speed up and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
Siemens Automates 2 5D, 3D IC Design-for-test with New Tessent Multi Die Solution iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.