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New Electronics - Siemens automates 2 5D and 3D IC design-for-test for next generation ICs

Siemens Digital Industries Software has introduced the Tessent Multi-die software solution, which it says will help customers speed up and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.

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Siemens Automates 2 5D, 3D IC Design-for-test with New Tessent Multi Die Solution

Siemens Automates 2 5D, 3D IC Design-for-test with New Tessent Multi Die Solution
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Khi Thiếu Lâm Tự kinh doanh

Khi Thiếu Lâm Tự kinh doanh
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