New institute accelerates future of microelectronic system integration, advanced packaging purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.
WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda .
Stanford explainer: Semiconductors stanford.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from stanford.edu Daily Mail and Mail on Sunday newspapers.
The US National Science Foundation has invested $45.6m to progress new semiconductor technologies and manufacturing methods in support of a domestic supply chain.