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Chiplet Pioneer Eliyan Names Noted Communications Circuit Expert and IEEE Pederson Award Winner Dr Behzad Razavi as Chief Technologist

Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

SANTA CLARA, Calif. – January 24, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization efforts, bringing its expertise to enable more universal and cost-effective methods for implementing die-to-die interconnect in heterogenous single packaged systems. Eliyan will have…

Semiconductor VC funding dives, startups plan for next boom

Semiconductor VC funding dives, startups plan for next boom
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Startup Funding: November 2022

Startup Funding: November 2022
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