Increasing Volume of E-Waste has Potential to Impact Computer and Peripheral Equipment Manufacturing Businesses
prnewswire.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from prnewswire.com Daily Mail and Mail on Sunday newspapers.
Increasing Volume of E-Waste has Potential to Impact Computer and Peripheral Equipment Manufacturing Businesses
prnewswire.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from prnewswire.com Daily Mail and Mail on Sunday newspapers.
NEW YORK, July 25, 2021 /PRNewswire/
The global wafer dicing saws market is expected to grow by USD 91.16 million during 2021-2025, according to Technavio s latest market report. Based on our research, the Semiconductor Equipment sector witnessed a Mixed impact due to the widespread growth of the COVID-19 pandemic. The report also throws light on the pre- and post-impact of COVID-19 on businesses.
- Advertisement -
The wafer dicing saws market share growth by the pureplay foundries segment has been significant and is expected to provide significant growth opportunities to market vendors.
86% of the market s growth will originate from APAC during the forecast period. Taiwan, South Korea (Republic of Korea), Japan, and China are the key markets for wafer dicing saws market in APAC.