NEW YORK, July 25, 2021 /PRNewswire/
The global wafer dicing saws market is expected to grow by USD 91.16 million during 2021-2025, according to Technavio s latest market report. Based on our research, the Semiconductor Equipment sector witnessed a Mixed impact due to the widespread growth of the COVID-19 pandemic. The report also throws light on the pre- and post-impact of COVID-19 on businesses.
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The wafer dicing saws market share growth by the pureplay foundries segment has been significant and is expected to provide significant growth opportunities to market vendors.
86% of the market s growth will originate from APAC during the forecast period. Taiwan, South Korea (Republic of Korea), Japan, and China are the key markets for wafer dicing saws market in APAC.
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NEW YORK, July 25, 2021 /PRNewswire/
The global wafer dicing saws market is expected to grow by USD 91.16 million during 2021-2025, according to Technavio s latest market report. Based on our research, the Semiconductor Equipment sector witnessed a Mixed impact due to the widespread growth of the COVID-19 pandemic. The report also throws light on the pre- and post-impact of COVID-19 on businesses.
Attractive Opportunities in Wafer Dicing Saws Market - Forecast 2021-2025
The wafer dicing saws market share growth by the pureplay foundries segment has been significant and is expected to provide significant growth opportunities to market vendors.