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Pushing Boundaries in Quantum Computing: IEEE Quantum Week 2023 Unveils Cutting-Edge Research, Training, and Breakthroughs

Pushing Boundaries in Quantum Computing: IEEE Quantum Week 2023 Unveils Cutting-Edge Research, Training, and Breakthroughs
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United statesEdge researchInternational conference on quantum computingProcessing societyTechnology engineering management societyComputer societyCommunications society comsocElectronics packaging societyCouncil of superconductivityPower energy societyDigital libraryElectron devices societyConsumer technology society ctsocDirections committeePhotonics societyQuantum computing

TopLine to Present at IMAPS Symposium 2023

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United statesSan diegoMartin hartInternational microelectronics assemblyInternational symposium on microelectronicsPackaging societyTopline corporationSolder columnsReplace solder ballsLead free braided copper solder columnsThermal expansionInternational symposiumInteractive poster

EIPC Summer Conference 2023: The Keynote Session

EIPC Summer Conference 2023: The Keynote Session
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Republic ofUnited statesUnited kingdomAlun morganDongkai shangguanJon custer topaiStan heltzelEliezer yudkowskyTarja rapala virtanenTime magazineEuropean space agencyMicrovia working groupEuropean commissionInternational microelectronics assemblyPackaging societySummer conference

Indium Corporation Expert Honored by IEEE EPS · EMSNow

Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honored by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing

United kingdomWilliamd ashmanDongkai shangguanIndium corporation strategic advisor drSan jose state universityTsinghua universityUniversity of alabamaExcellence in electronics manufacturing awardTechnology conferenceElectronics manufacturing technology awardElectronics componentsUniversity of oxfordIndium corporationUniversity of cambridgeElectronics packaging societySociety of manufacturing engineer

Indium Corporation Expert Honored by IEEE EPS

Indium Corporation Expert Honored by IEEE EPS
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United statesUnited kingdomDongkai shangguanWilliamd ashmanUniversity of alabamaSociety of manufacturing engineerElectronics manufacturing technology awardIndium corporation strategic advisor drElectronics packaging societyExcellence in electronics manufacturing awardUniversity of oxfordUniversity of cambridgeTsinghua universityElectronics componentsIndium corporationTechnology conference