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Development of Innovative Advanced Packaging Materials for System in Package · EMSNow

Development of Innovative Advanced Packaging Materials for System in Package · EMSNow
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Dongkai shangguanPower electronics thermal managementIndium corporationIndium corporation strategic advisorIndium corporation strategicAdvanced packaging

EIPC Summer Conference 2023: The Keynote Session

EIPC Summer Conference 2023: The Keynote Session
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Republic ofUnited statesUnited kingdomAlun morganDongkai shangguanJon custer topaiStan heltzelEliezer yudkowskyTarja rapala virtanenTime magazineEuropean space agencyMicrovia working groupEuropean commissionInternational microelectronics assemblyPackaging societySummer conference

Indium Corporation Expert Honored by IEEE EPS · EMSNow

Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honored by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing

United kingdomWilliamd ashmanDongkai shangguanIndium corporation strategic advisor drSan jose state universityTsinghua universityUniversity of alabamaExcellence in electronics manufacturing awardTechnology conferenceElectronics manufacturing technology awardElectronics componentsUniversity of oxfordIndium corporationUniversity of cambridgeElectronics packaging societySociety of manufacturing engineer

Indium Corporation Expert Honored by IEEE EPS

Indium Corporation Expert Honored by IEEE EPS
iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.

United statesUnited kingdomDongkai shangguanWilliamd ashmanUniversity of alabamaSociety of manufacturing engineerElectronics manufacturing technology awardIndium corporation strategic advisor drElectronics packaging societyExcellence in electronics manufacturing awardUniversity of oxfordUniversity of cambridgeTsinghua universityElectronics componentsIndium corporationTechnology conference

Indium Corporation s Dongkai Shangguan to Deliver Keynote on Complexities of Interconnect Reliability at IMAPS NordPac

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South koreaUnited kingdomWilliamd ashmanDongkai shangguanUniversity of oxfordExcellence in electronics manufacturing awardSan jose state universityStrategic advisor to indium corporationUniversity of alabamaTsinghua universityIndium corporationInternational microelectronics assemblyPackaging societySociety of manufacturing engineerUniversity of cambridgeStrategic advisor at indium corporation