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Samsung eyes AI chip leadership with highest-capacity HBM3E

Samsung Electronics said Tuesday it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date, going one step further than its rivals in the burgeoning artificial intelligence chip market. The world's largest memory chip maker said it has begun providing samples of HBM3E 12H to customers, and mass production is slated for the first half of this year. &ld.

New Electronics - Samsung launches 36GB HBM3E 12H DRAM, boosting capacity by 50%

Samsung Electronics has developed the industry’s first 12-stack HBM3E DRAM and the highest-capacity High Bandwidth Memory (HBM) product to date.

Samsung Intros 12-Stack HBM3E DRAM, Setting Standard in Memory Technology

Samsung Intros 12-Stack HBM3E DRAM, Setting Standard in Memory Technology
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