MOUNTAIN VIEW, Calif., Oct. 7, 2021 /PRNewswire/ Highlights of this Announcement: The DesignWare HBM3 Controller, PHY, and Verification IP reduces integration risk and maximizes memory performance in 2.5D multi-die systems Low-latency HBM3 Controller with flexible configuration options enhance memory bandwidth Pre-hardened or configurable HBM3 PHY in 5-nm process operates at 7200 Mbps for up to 2X…
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1:13 pm
Samsung has started mass-producing its datacentre SSD storage customised for Hyperscale, in the form of the PM9A3 E1.S. Constructed using Samsung’s sixth-generation (1xx-layer) V-NAND, the PM9A3 dramatically improves performance over the fifth-generation V-NAND-based PM983a (M.2), with double the sequential write speed at 3000MB/s, a 40% higher random read speed of 750K IOPS and 150% higher random writes at 160K IOPS.
The new PM9A3 fully complies with the Open Compute Project (OCP) NVMe Cloud SSD specification, enabling SSD providers to design next-generation storage solution with enhanced effectiveness.
“Wider 5G deployment and accelerating growth in IoT devices are fueling a hyperconnected lifestyle, driving the demand for more sophisticated hyperscale data centers,” said Cheolmin Park, vice president of Memory Product Planning at Samsung Electronics.
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2:00 pm
Samsung has announced that it has developed some new High Bandwidth Memory with AI Processing Power.
The new HBM or High Bandwidth Memory comes with Ai capabilities built in, it is designed for large scale data centers and high performance computers.
Kwangil Park, senior vice president of Memory Product Planning at Samsung Electronics stated, “Our groundbreaking HBM-PIM is the industry’s first programmable PIM solution tailored for diverse AI-driven workloads such as HPC, training and inference. We plan to build upon this breakthrough by further collaborating with AI solution providers for even more advanced PIM-powered applications.”
Rick Stevens, Argonne’s Associate Laboratory Director for Computing, Environment and Life Sciences commented, “I’m delighted to see that Samsung is addressing the memory bandwidth/power challenges for HPC and AI computing. HBM-PIM design has demonstrated impressive performance and power gains on important classes o