SK hynix is joining hands with TSMC, the world’s top foundry, to develop High Bandwidth Memory 4 and cutting-edge packaging technology, the company said on Friday. Under the partnership agreement, the two sides plan to proceed with the development of HBM4, the sixth-generation model of the advanced memory chip, and enhance logic and HBM integration through advanced packaging technology, SK hynix said. "We .
SK hynix has joined forces with TSMC to develop its next-generation high-bandwidth memory (HBM) chips to meet the growing demand for artificial intelligence (AI) chips from global clients, the Korean chipmaker said Friday.