SK hynix is joining hands with TSMC, the world’s top foundry, to develop High Bandwidth Memory 4 and cutting-edge packaging technology, the company said on Friday. Under the partnership agreement, the two sides plan to proceed with the development of HBM4, the sixth-generation model of the advanced memory chip, and enhance logic and HBM integration through advanced packaging technology, SK hynix said. "We ...
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Taiwan , Kevin Zhang , Kim Joo Sun , Business Development , Micron Technology , Samsung Electronics , Operations Office , High Bandwidth Memory , Overseas Operations Office ,
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