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India Plans Rs 10,000 Cr Revamped Scheme For Domestic Semiconductor Component Manufacturing

India Plans Rs 10,000 Cr Revamped Scheme For Domestic Semiconductor Component Manufacturing
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How India is trying to build a crucial part of its chip-making project

The new incentive plan which is likely to be launched at the start of the next fiscal year will have a corpus of Rs 10,000 crore, ET has reported. It will be an updated version of the current Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS).

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In works: Rs 10,000 crore sop scheme for chip ancillaries, Telecom News, ET Telecom

Semiconductor Incentives: In addition to the ATMP (assembly, testing, marking, packaging) plants announced by Micron, Tata Electronics and Kaynes Corp others like the HCL Group and Tamil Nadu-based Murugappa Group are also finalising their plans to enter the sector.

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semiconductor: In works: Rs 10,000 crore sop scheme for chip ancillaries

The pari-passu or equal footing method for disbursal of incentives is one where the government releases the funds to successful applicants as and when they invest or achieve certain milestones.

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Inside Juspay s new adventures; revised incentive scheme for chip ancillaries soon

Fintech startup Juspay is building a full-stack payment gateway that can offer card, wallet and UPI-based transactions. This and more in todays ETtech Morning Dispatch.

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