Growth Drivers
Increasing Power Consumption and Shrinking Size of Devices
Market Challenges
Delays in Spectrum Allocation and Deployment of Small Cells Expected to Impact the Demand for Thermal Interface Materials for 5G
Physical Properties of Traditional Thermal Interface Materials
Market Opportunities
Countries at a Nascent Stage of 5G Roll-Out Expected to Introduce Growth Opportunities for 5G TIM Manufacturers
Impact of Thermal Interface Material Dielectric Constant on EMI Radiation
Key Companies Profiled
Fuji Polymer Industries Co., Ltd., Laird Technologies, Inc., Henkel Corporation, Dow, W.L. Gore & Associates, Inc., Panasonic Corporation, Jiangxi Dasen Technology Co., Ltd., 3M Company, Shin-Etsu Chemical Co., Ltd., Denka Company Limited, JONES TECH PLC, T-Global Technology Co., Ltd., Parker Hannifin Corp, Momentive Performance Materials, Inc., Dongguan Sheen Electronic Technology Co., Ltd.