Thermal Interface Materials (TIMs) Market to grow at a CAGR of 13 42% from 2022 to 2027|APAC estimated to contribute 69% to the market growth tmcnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from tmcnet.com Daily Mail and Mail on Sunday newspapers.
Growth Drivers
Increasing Power Consumption and Shrinking Size of Devices
Market Challenges
Delays in Spectrum Allocation and Deployment of Small Cells Expected to Impact the Demand for Thermal Interface Materials for 5G
Physical Properties of Traditional Thermal Interface Materials
Market Opportunities
Countries at a Nascent Stage of 5G Roll-Out Expected to Introduce Growth Opportunities for 5G TIM Manufacturers
Impact of Thermal Interface Material Dielectric Constant on EMI Radiation
Key Companies Profiled
Fuji Polymer Industries Co., Ltd., Laird Technologies, Inc., Henkel Corporation, Dow, W.L. Gore & Associates, Inc., Panasonic Corporation, Jiangxi Dasen Technology Co., Ltd., 3M Company, Shin-Etsu Chemical Co., Ltd., Denka Company Limited, JONES TECH PLC, T-Global Technology Co., Ltd., Parker Hannifin Corp, Momentive Performance Materials, Inc., Dongguan Sheen Electronic Technology Co., Ltd.