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Micron First to Market With LPDDR5X-based LPCAMM2 Memory, Transforming User Experiences for PCs

Higher performance, better power consumption, smaller form factor LPCAMM2 memory enables faster, lighter, smaller notebooks with longer battery life and modularity for serviceability and.

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Idaho
United-states
Yasumichi-tsukamoto
Andy-lee
Praveen-vaidyanathan
Kelly-sasso
Dimitrios-ziakas
Io-technology-at-intel
Gallery-micron-technologies-inc
Lenovo
Micron-technology

Micron Technology (MU) Unveils LPDDR5X-based LPCAMM2 Memory

Micron Technology (MU) Unveils LPDDR5X-based LPCAMM2 Memory
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Praveen-vaidyanathan
Andy-lee
Yasumichi-tsukamoto
Micron-technology-inc
Product-solutions-development-at-lenovo
Micron-compute-products-group
Nasdaq
Io-technology-at-intel
Intel
Micron-technology
Compute-products

Micron First to Market With LPDDR5X-based LPCAMM2 Memory, Transforming User Experiences for PCs

Micron First to Market With LPDDR5X-based LPCAMM2 Memory, Transforming User Experiences for PCs
streetinsider.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from streetinsider.com Daily Mail and Mail on Sunday newspapers.

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United-states
Boise
Dimitrios-ziakas
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Kelly-sasso
Praveen-vaidyanathan
Andy-lee
Product-solutions-development-at-lenovo
Intel
Micron-technology-inc
Io-technology-at-intel

Micron, Winbond, Samsung Announced New Memory Technologies And Toshiba Announces 22TB HDD

Micron announces 1-beta DRAM . Winbond announces its CUBE memory . Samsung announces its detachable LPCAMM memory modules. Toshiba joins the 22TB HDD club.

Dimitrio-ziakas
Western-digital
Io-technology-at-intel
Samsung
Intel
Toshiba
Low-power-compression-attached-memory-module
Micron
Ncube
Winbond
3d-cube

Samsung Develops Industrys First HKMG-Based DDR5 Memory; Ideal for Bandwidth-Intensive Advanced Computing Applications

Posted March 25th, 2021 for Samsung 512GB capacity DDR5 module made possible by an 8-layer TSV structure HKMG material reduces power by 13 percent while doubling the speed of DDR4 Samsung Electronics, the world leader in advanced memory technology, today announced that it has expanded its DDR5 DRAM memory portfolio with the industry’s first 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology. Delivering more than twice the performance of DDR4 at up to 7,200 megabits per second (Mbps), the new DDR5 will be capable of orchestrating the most extreme compute-hungry, high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications.

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Carolyn-duran
Samsung
Io-technology-at-intel
Samsung-electronics
Memory-planning-enabling-group-at-samsung-electronics
Intel
Highk-metal-gate
Vice-president
Enabling-group
Intel-xeon-scalable
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