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Tektronix Announces Breakthrough Margin Test Solution

/PRNewswire/ Tektronix, Inc. today announced a new product category that revolutionizes PCI Express testing, transforming time to market, cost, and.

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Intel Introduces Two Monolithic Agilex FPGA and SoC Families, Part 1

This week at the Intel Innovation event held in Silicon Valley, Intel previewed not one but two new families in its Agilex FPGA and SoC product lines: the Intel Agilex D-series FPGAs and SoCs and a to-be-named FPGA and SoC family formerly known as “Sundance Mesa.” High-end Intel Agilex devices have been fairly successful and,…

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Enabling Next-Generation Platforms Using Intel s 3D System-in-Package Technology - High-Performance Computing News Analysis

Enabling Next-Generation Platforms Using Intel s 3D System-in-Package Technology - High-Performance Computing News Analysis
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Intel stratix

Open source chip design: The big picture of RISC-V ecosystem is emerging

In this article we try to provide you design software/tools companies offering product and support service to RISC-V based chip designs from small companies to biggest chip design experts such as Intel.

David kelfMasayuki itoAllen baumCharlie hauckTim kogelMelaine faconSimon davidmaanRick oconnorImperas systemverilogShubhodeep roy choudhuryItai yaromSimon davidmannScot morrisonHideki sugimotoOpenhw verification task groupSiemens digital industries software

Samsung Announces 3nm Process Node, the First with Gate-All-Around FETs

It appears that Samsung is the – ahem – first out of the gate with a gate-all-around (GAA) FET IC process technology. The company recently announced initial semiconductor production with its 3nm process node. Samsung’s trademarked name for its version of a GAAFET is “MBCFET,” which stands for “Multi-Bridge-Channel FET.” Since a picture is often…

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