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Intel Senior News Today : Breaking News, Live Updates & Top Stories | Vimarsana

Intel Foundry Collaborating With Cadence On SoC Designs Using Cutting-Edge 18A Process

Intel has announced the expansion of its collaboration with Cadence on the development of SoCs based on the cutting-edge 18A process node.

Next-Gen Intel Chips Will Feature More Sand As Glass Is Set To Replace Organic Substrate Materials

Intel showcased its next-gen Glass Substrate packaging technology which will replace existing organic materials & offer higher interconnects.

Intel Reaches Foundry Deal With Tower Semiconductor, Investment Reaches Up To $300 Million

Intel Foundry and Tower Semiconductor have reportedly agreed on collaboration, as both companies previously exited from a $5.4 billion deal.

Marvell Joins Universal Chiplet Interconnect Express Consortium

Marvell Joins Universal Chiplet Interconnect Express Consortium
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Chiplets Emerge to Package Multiple Functions

Here are some examples of chiplets either demonstrated or used in production ICs.

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