5 Companies That Came To Win This Week
For the week ending April 30, CRN takes a look at the companies that brought their ‘A’ game to the channel. By Rick Whiting April 30, 2021, 11:14 AM EDT
The Week Ending April 30
Topping this week’s Came to Win list is IBM for a strategic acquisition that will advance the company’s hybrid cloud management and AIOps capabilities.
Also making the list are container security tech developer Sysdig for an impressive funding round, Microsoft for its ambitious data center construction plans, Intel and Samsung for a new co-engineering partnership to develop next-generation processors and PCs, and VMware for a strategic sales hire.
Intel and Samsung have expanded their alliance to deliver a new line of co-engineered PCs they say will push the envelope on mobility, connectivity and performance and some of them will eventually feature a new microarchitecture utilizing different kinds of Intel silicon.
The Santa Clara, Calif.-based chipmaker announced the expanded co-engineering partnership during the virtual Samsung Unpacked event on Wednesday, where the South Korean tech giant announced several new PCs, including the new Intel-powered Galaxy Book Pro series of laptops.
The semiconductor giant said it will collaborate with Samsung on a new Intel chip microarchitecture that uses “multiple types of XPU cores,” a reference to Intel’s heterogeneous compute portfolio of silicon that ranges from CPUs and GPUs to FPGAs and other kinds of accelerators. Intel did not provide any further information on the new chip microarchitecture, including whether it is unique to future Samsung designs or part of the company�
Intel, Samsung Team Up For New PCs, Chip Microarchitecture
The two companies are embarking on a new co-engineering and co-marketing partnership for PCs they say will push the envelope on mobility, connectivity and performance and some of the PCs will feature a new chip microarchitecture utilizing different kinds of Intel silicon. By Dylan Martin April 28, 2021, 04:22 PM EDT
Intel and Samsung have expanded their alliance to deliver a new line of co-engineered PCs they say will push the envelope on mobility, connectivity and performance and some of them will eventually feature a new microarchitecture utilizing different kinds of Intel silicon.
The Santa Clara, Calif.-based chipmaker announced the expanded co-engineering partnership during the virtual Samsung Unpacked event on Wednesday, where the South Korean tech giant announced several new PCs, including the new Intel-powered Galaxy Book Pro series of laptops.