Intel and Samsung have expanded their alliance to deliver a new line of co-engineered PCs they say will push the envelope on mobility, connectivity and performance — and some of them will eventually feature a new microarchitecture utilizing different kinds of Intel silicon.
The Santa Clara, Calif.-based chipmaker announced the expanded co-engineering partnership during the virtual Samsung Unpacked event on Wednesday, where the South Korean tech giant announced several new PCs, including the new Intel-powered Galaxy Book Pro series of laptops.
The semiconductor giant said it will collaborate with Samsung on a new Intel chip microarchitecture that uses “multiple types of XPU cores,” a reference to Intel’s heterogeneous compute portfolio of silicon that ranges from CPUs and GPUs to FPGAs and other kinds of accelerators. Intel did not provide any further information on the new chip microarchitecture, including whether it is unique to future Samsung designs or part of the company’s existing product roadmap for a broader set of customers.