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Cadence Integrity 3D-IC Platform Supports Advanced Multi-Chiplet Designs

Cadence Integrity 3D-IC Platform Supports Advanced Multi-Chiplet Designs
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Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs – Consumer Electronics Net

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs – Consumer Electronics Net
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Synopsys Expands Strategic Technology Collaboration with TSMC to Extend 3D-System Integration Solutions for Next-Generation High-Performance Computing Designs

/PRNewswire/ Highlights of this Announcement: Expanded strategic collaboration delivers comprehensive 3D-system integration capabilities, enabling the.

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Synopsys Digital and Custom Design Platforms Achieve Certification for TSMC N3 Process

MOUNTAIN VIEW, Calif., Oct. 20, 2021 Synopsys, Inc. today announced it has expanded its strategic technology collaboration with TSMC to deliver the

Suk leeShankar krishnamoorthyDesign infrastructure management divisionSilicon realization group at synopsysSynopsys incIntegrated fan outOpen innovation platformSynopsys fusion design platformSilicon realization groupSynopsys primetimeSynopsys testmax

Synopsys Expands Strategic Technology Collaboration with TSMC

Oct. 20, 2021 Synopsys, Inc. today announced it has expanded its strategic technology collaboration with TSMC to deliver the next level in system

Suk leeShankar krishnamoorthyDesign infrastructure management divisionSilicon realization group at synopsysSynopsys incIntegrated fan outOpen innovation platformSynopsys fusion design platformSilicon realization groupSynopsys primetimeSynopsys testmax