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Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

Highlights: ● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems ● The Tempus Timing Signoff Solution with inter-die analysis and STA technologies results in faster time to tapeout ● The Voltus IC Power Integrity Solution, tightly coupled with the…

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Cadence Integrity 3D-IC Platform Supports Advanced Multi-Chiplet Designs

Cadence Integrity 3D-IC Platform Supports Advanced Multi-Chiplet Designs
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Chin chi tengSuk leeDigital signoff group at cadenceDesign infrastructure management divisionCadence design systems incDesign systemsCadence tempusTiming signoff solutionIntegrated fan outCadence intelligent system designCadence integrityCadence allegroCadence virtuosoTempus timing signoff solutionCadence celsiusThermal solver

Tower Semiconductor And Cadence Announce New Reference Flow For Advanced 5G Communications And Automotive IC Development

Cadence Design Systems, Inc. (Nasdaq: CDNS) and Tower Semiconductor (Nasdaq/TASE: TSEM), the leading foundry of high-value analog semiconductor.

Migdal haemekHa afonSige biTower semiconductor ltdCadence design systems incGroup at cadenceTower semiconductorTower semiconductor viceCompanies to workDesign centerTower semiconductor nasdaqGlobenewswire incVirtuoso design platformDesign systemsDesign platformSilicon germanium

Tower Semiconductor, Cadence Announce New Reference Flow for Advanced 5G

Tower Semiconductor, Cadence Announce New Reference Flow for Advanced 5G
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