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New packaging technology to improve the performance and thermals of the Exynos 2400 SoC

Samsung Foundry is expected to use a new packaging technology to improve the performance of the Exynos 2400 chipset.

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Latest US sanctions drive China to review chiplet capabilities as the way forward

Latest US sanctions drive China to review chiplet capabilities as the way forward
digitimes.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from digitimes.com Daily Mail and Mail on Sunday newspapers.

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Kaynes Technology to invest ₹2,800 crore on semiconductor facility

Kaynes Technology to invest ₹2,800 crore on semiconductor facility
thehindubusinessline.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from thehindubusinessline.com Daily Mail and Mail on Sunday newspapers.

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Advanced Packaging Market Size To Reach Usd 66 9 Billion By 2032 | Cagr: 8 7% | Datahorizzon Research

Advanced Packaging Market Size To Reach Usd 66 9 Billion By 2032 | Cagr: 8 7% | Datahorizzon Research
menafn.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from menafn.com Daily Mail and Mail on Sunday newspapers.

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LG Innotek accelerates FC-BGA as the Global No 1 Business

LG Innotek accelerates FC-BGA as the Global No 1 Business
commonperu.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from commonperu.com Daily Mail and Mail on Sunday newspapers.

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