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DNP Develops TGV Glass Core Substrate for Semiconductor Packages

DNP Develops TGV Glass Core Substrate for Semiconductor Packages
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Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it

United statesJohnw mitchellUs congressTechnologist councilIc substrate manufacturing centerFlip chip ball grid arrayFlip chip scale packageManufacturing centerPresident bidenCommunications director

Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn
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United statesJohnw mitchellUs congressTechnologist councilIc substrate manufacturing centerFlip chip ball grid arrayFlip chip scale packageManufacturing centerPresident biden

LG Innotek accelerates FC-BGA as the Global No 1 Business

/PRNewswire/ LG Innotek (CEO Jeong Cheol-dong) is accelerating the business activities in full-scale for targeting the Flip-Chip Ball Grid Array (hereafter.

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LG Innotek Accelerates FC-BGA as the Global No 1 Business

LG Innotek Accelerates FC-BGA as the Global No 1 Business
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Jeong cheol dongFuji chimera research instituteFlip chip ball grid arrayDigital transformationRadio frequency systemApplication processors