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How new modular chiplets in advanced semiconductors defend against dynamic threats
Having digital technologies with silicon at their heart is how kinetic platforms like ships, planes, and next-generation ground vehicles become smart.
United states
Heidi shyu
Napoleon bonaparte
Cameron chehreh
Digital mission infrastructure
Intel corporation
Intel agilex
Dod chief technology officer heidi
Art heterogeneous integrated packaging
Multi chip package
Multi chip module
Field programmable gate array
Middle east
Gen intel
Gen intel xeon scalable
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