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PRODUCT OF THE WEEK: Viking Technology s Multi-Chip Package (MCP) DDR4 memory product

PRODUCT OF THE WEEK: Viking Technology s Multi-Chip Package (MCP) DDR4 memory product
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Technology multiViking technologyMulti chip packageChip package

The Worldfolio: Hanamicron bets on technology and collaboration to drive global expansion

The Worldfolio: Hanamicron bets on technology and collaboration to drive global expansion
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Lockheed Martin boosts microelectronics capabilities for Pentagon aerial defense program

Lockheed Martin boosts microelectronics capabilities for Pentagon aerial defense program
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New yorkUnited statesDeon viergutzLockheed martinMintel companyIntel corporationStrategic spectrum missions advanced resilient trusted systemsNational security technology acceleratorUs navyOffice of theNaval surface warfare centerStimulating transitionAdvanced microelectronics packagingSensor open systems architectureMulti chip packageMilitary aerospace

HeliHub com : Lockheed Martin to develop airborne defense system for potential MH-60R use

HeliHub com : Lockheed Martin to develop airborne defense system for potential MH-60R use
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New yorkUnited statesDeon viergutzNaval surface warfare centerStrategic spectrum missions advanced resilient trusted systemsUs navyNational security technology acceleratorMintel companyIntel corporation nasdaqLockheed martinOffice of theIntel corporationStimulating transitionAdvanced microelectronics packagingSensor open systems architectureMulti chip package

SOSA aligned airborne electronic defense system for MH-60R helicopter to be built by Lockheed Martin

OWEGO, N.Y. Lockheed Martin, Intel Corp., and Altera, an Intel Company, are joining hands to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program for the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E). Lockheed Martin will develop a low size, weight, and power (SWaP), Sensor Open Systems Architecture (SOSA) aligned airborne electronic defense system, leveraging the Altera Multi-Chip Package (MCP2) for expected use on the U.S. Navy’s MH-60R multi-mission helicopter. 

New yorkUnited statesDeon viergutzOffice of theIntel corpMintel companyUs navyNational security technology acceleratorNaval surface warfare centerLockheed martinStrategic spectrum missions advanced resilient trusted systemsStimulating transitionAdvanced microelectronics packagingSensor open systems architectureMulti chip packageSenior director