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Chip Assembly: Behind the scenes: Inside Intel s advanced chip packaging, assembly, and testing facilities in Malaysia

Intel recently provided a tour of its chip packaging, assembly, and testing facilities in Malaysia. The Penang Assembly and Test (PGAT) facility assem

Pulau pinangPenang assemblyManufacturing servicesDesign and development lab in penangIntel kulim die sort prepDie sort prepSystem integrationHigh density modular testerSystem level testerChip attachIntegrated heat spreaderDesign and development labPenang assembly and testKulim die sort prepIntel malaysiaChip testing

I got a peek into Intel s largest offshore plant

Intel gave us access to its biggest offshore facility located in Malaysia to show us how it manufactures CPUs.

Penang islandPulau pinangDesign and development labManufacturing servicesPenang assemblyTeam blueKunal khullarTech tourIntel kulim die sort prepIntel penangIntel kulimAdvanced packagingChip attachIntegrated heat spreaderSystem integrationIntel malaysia

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